Description

Webinar Talk: "Why Electronic Packaging Matters: Influence of Engineers as an IP "Differentiator"

Date:18th February 2023
Time:9.00am – 11.00am
Venue:Online platform (Zoom)
Fee:RM15 (members), RM70 (non-members)
Speaker:Dr. Wong Shaw Fong & Dr. Lee Yuan Thing

SYNOPSIS

The semiconductor package is evolving in a very fast pace lately. Many research institution and industries are aggressively working towards advanced packaging solution for functional
integration. This advanced packaging is predicted would account for >50% of all packaging services by 2030. Segmentation in packaging design by field application used to be a key enabler for silicon solution. However, innovations in packaging intellectual property (IP) have been constantly re-invented, exploring the potential options for extremely high volumes. This
likely to pay back the enormous up-front investment and therefore, packaging scaling is becoming critical and more economical to achieve. Though, and in many new or existing IoT, client and server applications, packaging is becoming a key differentiator. The packaging technology strategies must accommodate cost effective solutions using standard packaging technologies while still push for significant product advancement. The differentiator examples include ultrathin and small packages for mobility, large and thick packages for extreme high density and functionality applications. Also, our industry is heading toward more and more heterogeneous integration, enabling in packaging process and assembly execution mostly driven to further benefit with the higher volumes and scaling of production/ market share.

This talk will share the overview of electronic packaging design, product or market segmentation and address the strategies to overcome the diverse and complex demands. Some
possible differentiator opportunities include design tool, material enhancement, assembly advancement and development ecosystem, which must be revisited at every step of the flow,
from initial concept and design all the way through to manufacturing. The sharing also will cover some of the latest focus by Malaysia local universities researchers as well as the critical work by industry and manufacturing sites.

SPEAKER’S PROFILE

Speaker-1: Dr. Wong Shaw Fong

Shaw Fong joined Intel Malaysia back to early millennium and had assumed different positions related to packaging process, assembly, test and material technology developments. Lately, Shaw Fong is with the Kulim-1 Factory Module Engineering. He has total combination of 12 patents filling and Intel Trade Secrets, with numerous internal/external technical publications. He had served as IEEE/Electronic Packaging Society (EPS) Malaysia Chapter Chair. SF’s hobby is sport games esp. in football which Liverpool is his favourite team. YNWA!


Speaker-2: Dr. Lee Yuan Thing

Lee Yuan Thing, also known as YT Lee, is a graduate from USM. He is with 25 years of experience in Technology development to Manufacturing operation. He has published more than 30 technical publications in some regional and international conferences or journals. He is currently the Factory Integration Operation Manager working on process integration and new production and technology introduction. He is very passionate about thermal and mechanical design and have a fundamental understanding of the semiconductor manufacturing and test process.